triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information november 14, 2005 1 k band packaged low noise amplifier TGA4506-SM key features ? 21-27 ghz bandwidth ? 21 db nominal gain ? 2.5 db nominal noise figure ? 10 dbm nominal p1db ? bias: 3.5 v, 60 ma ? package dimensions: 4.0 x 4.0 x 1.1 mm (0.157 x 0.157 x 0.043 in) primary applications ? point-to-point radio ? point-to-multipoint radio measured data bias conditions: vd = 3.5 v, id = 60 ma -20 -15 -10 -5 0 5 10 15 20 25 21 22 23 24 25 26 27 frequency (ghz) s-parameter (db) s11 s21 s22 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 21 22 23 24 25 26 freq (ghz) nf (db) note: this device is early in the characterization process prior to finalizing all electrical specifications. specifications ar e subject to change without notice. product description the triquint TGA4506-SM is a k-band packaged low noise amplifier. the TGA4506-SM operates from 21-27 ghz and is designed using triquints production phemt process. the TGA4506-SM typically provides 2.5 db noise figure and 21 db small signal gain. the TGA4506-SM is ideally suited for point-to-point radio and point-to- multipoint radio communications. evaluation boards are available upon request. lead-free & rohs compliant.
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information november 14, 2005 2 TGA4506-SM table i maximum ratings 1 / symbol parameter value notes vd drain voltage 5 v 2/ vg gate voltage range -1.5 to 0v id drain current 190 ma 2 / ? ig ? gate current 6 ma p in input continuous wave power 9 dbm p d power dissipation 0.24w 2 / 3 / t ch operating channel temperature 117 0 c 4 / t m mounting temperature (30 seconds) 260 0 c t stg storage temperature -65 to 150 0 c 1 / these ratings represent the maximum operable values for this device. 2 / combinations of supply voltage, supply current, input power, and output power shall not exceed p d . 3/ when operated at this bias condition with a package base plate temperature of 85, the median life i s 1e+6 hrs. 4/ junction operating temperature will directly affect the device median time to failure (mttf). for maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels.
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information november 14, 2005 3 TGA4506-SM table ii electrical characteristics (ta = 25 0 c nominal) parameter typical units drain voltage, vd 3.5 v drain current, id 60 ma gate voltage, vg -0.5 to 0.0 v small signal gain, s21 21 db input return loss, s11 11 db output return loss, s22 15 db noise figure, nf 2.5 db output power @ 1 db compression gain, p1db 10 dbm table iii thermal information parameter test conditions t ch ( o c) r t jc ( q c/w) t m (hrs) r q jc thermal resistance (channel to backside of package) vd = 3.5v i d = 0.06 a pdiss = 0.21 w 112.7 132 1.52e+6 note: package backside snpb soldered to carrier at 85 c baseplate temperature.
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information november 14, 2005 4 TGA4506-SM measured data bias conditions: vd = 3.5 v, id =60 ma 10 12 14 16 18 20 22 24 26 16 18 20 22 24 26 28 30 frequency (ghz) s21 (db) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 21 22 23 24 25 26 frequency (ghz) nf (db)
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information november 14, 2005 5 measured data TGA4506-SM bias conditions: vd = 3.5 v, id =60 ma -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 16 18 20 22 24 26 28 30 frequency (ghz) s11 (db) -30 -25 -20 -15 -10 -5 0 16 18 20 22 24 26 28 30 frequency (ghz) s22 (db)
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information november 14, 2005 6 measured data bias conditions: vd = 3.5 v, id =60 ma 6 7 8 9 10 11 12 13 14 15 16 17 18 20 21 22 23 24 25 26 27 frequency (ghz) output power (dbm) psat p1db TGA4506-SM -60 -50 -40 -30 -20 -10 0 -4-20246810 output power per tone (dbm) imd3 (dbc) 20 ghz 21ghz 22ghz 23ghz 24ghz 25ghz 26ghz 27ghz
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information november 14, 2005 7 package pinout diagram TGA4506-SM top view dot indicates pin 1 bottom view pin d escription 1, 5, 6, 10, 11, 15, 16, 20, 21 gnd 2, 4, 8, 9, 12, 14, 17, 18 nc 3 rf input 19 vg1 1 3 r f o u tp u t 7vd1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 tga 4506 date code lot code
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information november 14, 2005 8 mechanical drawing (bottom side) TGA4506-SM 20x 0.25 19x 0.40 16x 0.65 (pitch) 3.20 3.20 4x r0.13 4.000.25 4.000.25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 ground pad units: millimeters. tolerance is 0.076mm unless otherwise specified 2.200.125 2.200.125
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information november 14, 2005 9 TGA4506-SM recommended board layout assembly all measurements were made with the part soldered to 0.008 in thick ro4003 s) s) 7xqlqj 6wxe 7xqlqj 6wxe x) x) rkp rkp 9ja9 $gmxvw9jwrrewdlq ,g p$ 9g 9
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information november 14, 2005 10 recommended surface mount package assembly proper esd precautions must be followed while handling packages. clean the board with acetone. rinse with alcohol. allow the circuit to fully dry. triquint recommends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is not recommended. solder paste can be applied using a stencil printer or dot placement. the volume of solder paste depends on pcb and component layout and should be well controlled to ensure consistent mechanical and electrical performance. clean the assembly with alcohol. typical solder reflow profiles reflow profile snpb pb free ramp-up rate 3 c/sec 3 c/sec activation time and temperature 60 C 120 sec @ 140 C 160 c 60 C 180 sec @ 150 C 200 c time above melting point 60 C 150 sec 60 C 150 sec max peak temperature 240 c260 c time within 5 c of peak temperature 10 C 20 sec 10 C 20 sec ramp-down rate 4 C 6 c/sec 4 C 6 c/sec
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